Infrastructure
SYSTEM ENGINEERING FACILITY AND PACKAGING RESOURCES
The Systems Engineering Facility & Packaging Lab is a 2100 square feet facility which is an ESD safe workspace, has resources for Systems Development and Packaging of Micro Electronics.
SysEF houses various resources like
- Electronic Test & Measurement Equipments such as DSO, Function Generators, Digital Multimeters, Digital Counter, Infrared Thermal Scanners, Current Probes, Power Supplies, 3D Printers.
- ESD work stations, Soldering and Desoldering stations.
- Altium PCB Design, NX Software, IDE- Keil Compiler, STM32 Compiler.
- Mechanical Design Modelling, Analysis, CAD/CAM NX Software
- Pressure sensor calibration setup
- Calibrated Particulate matter counter,
- Various Gas & Pressure sensors,
- Electronic modules & components and
- Evaluation Boards Zed Board, Arduino Uno, Nano, Mega, STM32 Cubex.
- Temperature and RH Chambers for Environmental Tests.
- Lab Equipments Like Spectrum Analysers, Oscilloscopes, Desk Top Systems.
- PM Counter, Fluke Current Probes.
Packaging Lab houses equipments like
- Automatic Dicing Machine
- Wire Bonder
- Laser Welding System
- Dead Weight Pressure Caliberator
- Pressure Caliberator(Pneumatic)
- Parylene Deposition System
- Climate Chamber
- Semi Automatic Dicing
- Helium Leak Detector
