Packaging Lab Activities

Activities

Packaging Lab activities are divided into Design, Development and Services to CeNSE, IISc and External Users.

Some of the Key activities are as listed below:

  • Design and Development of MEMS based Absolute, Differential and Gauge
  • Pressure Transducers for High Reliability Applications.
  • Micropump Design and Development for Drug Delivery
  • Microthrusters Development
  • Body Conduction Hearing Aid Development
  • Wafer Dicing
  • Die –Wire bonding
  • Laser Welding of Metallic Packages
  • Pressure Transducer Testing and Calibration
  • Systems and Packaging Lab
  • Parylene Deposition for Protective Coating
  • Environmental- Thermal and Humidity Tests
  • Leak Detection Tests
  • GAN Devices Packaging.
  • Regular Calibration and Maintainence of all Equipments.