Research

MEMS PRESSURE TRANSDUCER

Wire Bonding and Packaged Devices

1.2 Mil Aluminium Wire Bond

20 Pin Biosensor- 100x100u Pad

40 Pin Biosensor- 100x100u Pad

18 Pin Biosensor- 100x100u Pad

Microheater for Aero Application

OTHER PROJECTS

RESULTS OF IOT MODULE

CENSE SERVER ROOM NODE

Click here to open

PACKAGING LAB NODE – PRESSURE

Click here to open

PACKAGING LAB NODE- TEMPERATURE

Click here to open

PACKAGING LAB NODE- HUMIDITY

Click here to open