Model: DAD321
The Disco Wafer Dicer is a automatic machine, suitable to dice wafer.
Specification:
- Wafer Size: 6”
- Wafer Material: Silicon and Pyrex glass wafers
- Min bade width: 0.2mm
Design Rules:
- The devices with features like diaphragms are to be minimum 25 microns thickness to be diced, if not they can be released after dicing.
- Maximum wafer size, circular 6” and square 4”, thickness of maximum 1.2mm
- Material of wafers can only be Silicon, Glass and bonded wafers.
- Saw Street/ gap between dies has to be minimum 0,4 mm
- Die size should be a minimum 1.5 x 1.5 mm
- The pitch in ‘X’ and ‘Y’ should be consistent though the whole wafer, including the spacing provided for alignment marks
Model: HB16
TPT Wirebonder is semiautomatic machine to establish connectivity between die and substrate.
Specification:
- Wire material: Au (25µ) & Cu, Al (33µ)
- Bonding type: Ball bonding, Wedge bonding & Ball Bump
- Minimum bond pad size: 150×150µ, pad pitch of 200µ
- Distance btw 1st & 2nd Bond: btw 1-5mm length
- Metallization thickness of 100nm of material Au/Al with a bond pad appropriate seed layer
- Wire Dimension: 17-75µ
- Ribbon max: 25×250µ
- Axis Control: Motorized Z & Y,Manual X
- Vertical Access Depth: 16mm
- Ultrasonic System: PLL control 62KHz transducer
- Ultrasonic Power: 0-2 Watt output
- Bond Time: 15 – 2,000 msec
- Bond Force: 15-150 cN
- Heater Stage Controller: Built-in 250 C max
- Electric Requirements: AC 220V,Single Phase,50Hz
Design Rules:
- Bond pad metallization thickness to be minimum 80nm, with a appropriate seed layer
- Available wire sizes Au (25 um) and Al (33 um) wires
- Thin film materials should be deposited using suitable clean room processes with good mechanical properties such as surface roughness scratch resistant and hardness
- The devices should be desiccated properly and without any formation of an oxide layer.
- Attachments for wire pull gauge to test the pull strength available
- Wire Diameter
- Au 1 and 2mil
- Al 1 and 1.2mil
- Ribbon 1mil x 5mil
- Bonding tool
- 1.2 mil Wedge tool
- 1mil fine pitch wedge tool
- 1mil capillary
- Bond Pad –TiPt,CrAu,TiAu(10/100),Al(300<)
- Bond Pad – 100×100 micron pitch 150micron
- Epoxy
- 2 part epoxy – H20 Conductive & H70 Non Conductive
- Cryo – G varnish
- Glob top – Epotec -302
- DAF – Lintec non conductive and UV tapes
- Substrate Mounting PCB Available at PASF will be used for Trials for Die Attach
Wire Bonding Tool Training & User Calendar
Note:-
- *For Independent Slots flexibility please contact SFT/FT before booking in FOM
- Please use the Service Request form before Submitting for Wirebodning and contact SFT/FT for more details.
Model: LW70AE
Laser Welding machine has capability of Spot and Seam welding MEMS packages made of metals and alloys such as SS304/304L/316/321, Kovar, Invar etc.
Tool Specifications:
- Type: Delta BDMS four (4) axis
- Enclosure: 40″W x 26″D x 40″H
- XY Table: M6″ x 6″
- Power Supply: 220 VAC, 50 Hz
- Work Holding: 5″ rotary stage with 3-jaw chuck & Collets
- Work Holding Capacity: 50mm diameter parts
Laser secifications:
- Type: Nd-YAG
- Coolant: Water Cooled
- Pulse Duration: 0.25-30ms
- Power Supply: 400 VAC, 3 – phase
- Max Avg Power: 70W
- Max Pulse Energy: 70J
- Wavelength: 1064nm
- Pulse repetition: 1-200Hz
Design Rules:
- Nd-YAG based welding machine
- Spot and continuous welding capability, with a spot size of a minimum 0.3mm and penetration of 0.7mm can be accomplished
- Work holding can accommodate a maximum component diameter of 40mm.
- Laser parameters are tuned to weld metals and alloys such as stainless steel and Kovar only
The Hydraulic Pressure Calibrator is dual piston dead weight tester primary standard tested for a pressure range of 0 to 1200 bar.
Pneumatic Calibrator is a digital pressure controller for a pressure range of 0 to 20 bar with data acquisition system.
These calibrators are available for pressure transducer testing and calibration.
The PDS is a vacuum system used for the vapor deposition of the Parylene-C polymer onto a variety of substrates. The clear polymer coating formed provides an extremely effective chemical and moisture barrier with high dielectric and mechanical strength.
Specification:
- Dimensions Width, (Nominal) Height, Depth: 19.5 in (49.5cm),50.5 in (128.3cm),23.75 in (60.4cm)
- Chamber Size: 12 inch dia. X 12 inch high (8.5”/31.5cm Dia. X 11.19”/28.4cm H, useable size)
- Power: 110/220 VAC, single phase, 50-60 Hz, 20/12 A
- Dimer Capacity: 125 grams
Model: VCL7003
This Hot and Cold Enclosure / Test Chamber is used for evaluating device quality, reliability and identify manufacturing flaws on MEMS devices.
Tool Specifications:
- Test space volume: 34 Lts
- Test Space Dimension: 350W x 300D x 310H mm
- Temperature Range for temperature tests: -700 C to +1800 C
- Temperature Range for climatic tests: +100 C to +950 C
- Humidity range: 10% r.h to 98% r.h
- Dew Point range: +5.50 C to +950 C
- Entry port Dimensions: Entry port, Ø 50 mm, r. h. side
- Data capture: Simpati, Software Package
Model: EC-400
The MTI Cut Wafer Dicer is semiautomatic machine, suitable to dice wafer of maximum size 4”. Wafer material can be Sillicon & Glass. The blade width is 0.35mm, device pitch should be around 2.5mm to facilitate angular alignment.
Specifications:
- Accuracy: 2.5µ moving resolution, 0.01mm position accuracy.
- Cutting Blades: 4” dia x 0.35mm thick fully sintered diamond blade
- Control Mode: Manual control/PC control
- Cutting Range: X-axis:4”, Y-axis:4”,Z-axis:4”
- Water Cooling: Water jet
- Power Consumption: 180W
- Voltage: AC220V, Single Phase, 50Hz
- Motor: DC motor 110V,variable speed max 3000rpm
- Make Oerlikon Leybold
- PhoeniXL300TL7
- Portable
- Min detectable helium leak rate Vacuum mode < 5×10-12 mbar x l/s Sniffer mode < 1×10-7 mbar x l/s
- Wafer Grinder
- Wafer Dicer
- Die Bonder
- Automatic Wire bonder
- Shear Tester
Vacuum Soldering Reflow Systems
Vacuum soldering reflow systems use a combination of pressure control, thermal profiles, and gas control to create bonds that are nearly void-free
and flueless. The VS 320 is a vacuum soldering system with a 320 mm x 320 mm heating plate size that’s suitable for research and development, as well as producing medium and large batches. Here are some more details about the VS 320 and vacuum soldering reflow systems:
VS 320
This system can be extended to a combined system with the SP 60 sintering press, which allows for the production of sintered joints under reduced or inert atmospheres. It also oers a variety of options, including hydrogen, HCOOH, special gases, microwave plasma, and sintering press.
Inline vacuum soldering systems
These systems can run various cleaning and soldering processes simultaneously within a single system. This is because the heating, cooling, and vacuum process steps take place in the same process chamber.
Vacuum reflow ovens
Some vacuum reflow ovens can automatically refill formic acid when the level in the bubbler drops below a certain level. This option is recommended for production purposes where a larger amount of formic acid is required.
Technical Data
- Plate size: 320 x 320 mm2
- Chamber height: 100 mm
- Max. soldering temperature: 450 °C
- Heating- / Coolingramp: 2 K/s
- Max. load: 15 kg
- Process atmosphere: N2, N2H2 (95/5)
- HCOOH, H2 (up to 100%)
- Power supply: 400 V / 32 A
- Cooling Water: 20 slm
Features
- Process-Control via separate thermocouples
- Graphical overview of process components
- Digital manual integrated in the software
- Maintenance reminder
- Proposal for changing necessary components at the end of lifetime
- Power monitoring to detect defective heating rods
- Monitoring of energy consumption (Industry 4.0)
- Optional manipulation inside the chamber
- Optional sintering device SP 60
