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The system mainly developed for study the reliability and ageing effect of the pressure transducers which will going to use on aerospace applications. The Pressure cycle test set up comprises of two solenoid valves – one for pressurizing and the other for depressurizing, an electronic square wave oscillator with transistor relay drive circuit for controlling the “ON” and “OFF” timings of the solenoid valves, power supply for exciting the electronics and solenoid valve, and pneumatic interconnecting adaptors. During the test, for recording the output data of the pressure transducer, data acquisition system is also incorporated in the set up.
OP/1
We have designed and developed a new hearing aid, named “Body Conduction Hearing Aid”, which is External Wearable Head Band. Conventionally, Sound is a vibration that travels through air as mechanical wave of pressure, reaches ear drums and vibrates. Whereas, In the Body Conduction does not make use of air pressure wave for hearing; Instead piezoelectric actuator is used for generating mechanical wave these wave travel through the human body; resulting in the name ‘Body Conduction’. Hence, ‘Body Conduction Hearing Aid’ is a hearing-aid, for Conductive hearing loss & Sensorineural hearing loss.
The Bone-conduction hearing aid is actuated by PZT Element. We have developed the Prototype and the working model of the same.
Sound energy beats on the body skin by the Body Conduction Vibrator, at the point of beating.Now, the rhythm is taken up by the skin and spreads along the surface of the skin, around the beating point, like micro dimensional ripples, along a disturbed fluid surface. Our Body is primarily a Body of Fluid. The Body Fluid is held in position by skin.
Thus, in the form of mechanical energy, the rhythmic wave moves along skin-surface of the fluid-filled Body. Similar to the way it behaves in the inner-ear cochlea, sound energy swims through the Body fluid and skin; sweeping across teeny, tiny roots of Body hairs that bend and snap. Body is the replica of inner-ear cochlea; with numerous hair anchored on to skin membrane.
Energy fires neurons, bundled into the nerves of touch, the skin nerves or touch nerves. The nerve’s long wires or axons, zings energy forward to lower brain structures, until the energy is analyzed in the speech processing center of the brain.
OP/6
Microthrusters are an application of MEMS technology to the field of aerospace. These are propulsion systems that require no elaborate pump, valves or piping systems. The work currently is centered around developing Microthrusters that are capable of operating in a continuous mode. From solid propellant combustion to decomposition of a liquid mono-propellant, different techniques have been explored to obtain thrusts in the range of a milliNewton sans compromising on the specific impulse
OP/5
Internet of Things (IoT), which is transforming almost every industry, including retail. Devices with smart sensors are capable of collecting and exchanging observational and transactional data with each other, making them seamlessly interconnected. The data gathered from IoT can be utilized to provide insights, trigger actions and control outcomes all in real time with or without any human intervention.
There are three stage in the development process First one will be the design of the sensor node, where all the sensor required for the monitoring parameter are put together with in an embedded system having a Wi-Fi transverse. The second will the Power Management. The third will be the Designing the architecture for Server. That provides functionality for other programs or devices, called “clients”(Sensor node). This architecture is called the client–server model, and a single overall computation is distributed across multiple processes or devices.
OP/4
POWER semiconductor device packaging is in many ways similar to that of IC packaging. It provides mechanical support to the fragile chip, electrical interconnections, heat dissipation paths, and protection from the environment. However, there are important differences between the two that are dictated by the functions of the power device. For example, the number of interconnections necessary is substantially less than that of a microprocessor. In a power MOSFET or insulated gate bipolar transistor (IGBT), a minimum of three interconnections are necessary (drain, source, and gate). Power devices usually handle much larger currents and voltages such that they require larger interconnections and more efficient thermal management. Such seemingly minor and simple differences may not be that easy to implement in real package structures because of constraints on the physical properties of the device and package component materials and the thermomechanical issues such as coefficient of thermal expansion (CTE) mismatches that can adversely affect the performance and reliability of the package or module.
OP/3
Micropump technology has emerged as a critical research area for the biological analysis, electronic component liquid cooling, medicine, space exploration, thermal management, etc. The pumping mechanism of the micropump will depend on their targeted applications. Mainly, three types of actuating mechanism based micropumps have been reported: (I) mechanical displacement, (II) electro-kinetic, and (III) magneto-kinetic. In present study, a mechanical displacement principle has been adopted. Peristalsis mechanism based pumps are called as peristaltic pumps. These peristaltic pumps often consist of rotating rollers to squeeze the flexible tube containing a fluid. The squeezing action of the peristaltic pump has been created by various means such as motor driven rollers, magnetic balls, Shape Memory Alloy (SMA) actuation, and Lead Zirconate Titanate (PZT). In the present study, a geared DC-motor driven roller/cam was used to squeeze the silicone tube to obtain the pumping action. The aim of this work is to design and develop a peristaltic micropump suitable for drug delivery application. In particular, development of an insulin delivery pump for diabetic people. While designing a micropump for drug delivery or insulin delivery application, one has to consider the following important aspects.
OP/2
Differential pressure transducer is connected to Pitot-Static system of the helicopter for sensing the pressure at the pitot and static port of the helicopter and converts this pressure into electrical signal. This signal of transducer shall be used by the recorder for continuous recording of the airspeed data of the helicopter.
Transducer specification is as below:
D/3
The unit consists of a suitable transducer and signal conditioning electronics. This converts a pressure input into a proportional DC voltage output. The unit is energized by 28 Vdc (16-32 Vdc) supply. The sensor output is 0.25V – 5.25 Vdc corresponding to 0 – 150 mbar differential input pressure range. It’s function is to sense the Differential pressure across the condenser and provide a proportional electrical signal.
Transducer specification is as below:
D/2
The unit consists of a suitable transducer and signal conditioning electronics. This converts a pressure input into a proportional DC voltage output. The unit is energized by 28 Vdc (16-32 Vdc) supply. The sensor output is 0.25V – 5.25 Vdc corresponding to 0 – 600 mbar D differential input pressure range. It’s function is to sense the Differential pressure across the condenser and provide a proportional electrical signal.
Transducer specification is as below:
D/1
It’s Application is mainly to find the measurement of Pressure inside Backup Oxygen Cylinder (BOS).
Transducer specification is as below:
G/4
It’s Application is mainly to find the measurement of pressure inside backup Oxygen cylinder (BOS).
Transducer specification is as below:
G/3
The unit consists of a suitable transducer and signal conditioning electronics. This converts a pressure input into a proportional DC voltage output. The unit is energized by 28 Vdc (16-32 Vdc) supply. The sensor output is 0.25V – 5 Vdc corresponding to 0.4 – 10bar input pressure range. It’s function is to sense the pressure of the air media of ECS and provide a proportional electrical signal.
Transducer specification is as below:
G/1
The unit consists of a suitable transducer and signal conditioning electronics. This converts a pressure input into a proportional DC voltage output. The unit is energized by 28 Vdc (16-32 Vdc) supply. The sensor output is 0.25V – 5.25 Vdc corresponding to 0 – 600 mbar G input pressure range. It’s function is to sense the pressure of the air media at Avionics Inlet and provide a proportional electrical signal.
Transducer specification is as below:
G/2
Absolute pressure transducer is connected to Pitot-static system of the helicopter for sensing the pressure at static port and converts this pressure into electrical signal. This signal of transducer shall be used by the recorder for continuous recording of the altitude data of the helicopter with reference to sea level (1013.25mbar).
Transducer specification is as below:
A/2
Model: EC-400
The MTI Cut Wafer Dicer is semiautomatic machine, suitable to dice wafer of maximum size 4”. Wafer material can be Sillicon & Glass. The blade width is 0.35mm, device pitch should be around 2.5mm to facilitate angular alignment.
Specifications:
Model: VCL7003
This Hot and Cold Enclosure / Test Chamber is used for evaluating device quality, reliability and identify manufacturing flaws on MEMS devices.
Tool Specifications:
The PDS is a vacuum system used for the vapor deposition of the Parylene-C polymer onto a variety of substrates. The clear polymer coating formed provides an extremely effective chemical and moisture barrier with high dielectric and mechanical strength.
Specification:
Pneumatic Calibrator is a digital pressure controller for a pressure range of 0 to 20 bar with data acquisition system. These calibrators are available for pressure transducer testing and calibration.
The Hydraulic Pressure Calibrator is dual piston dead weight tester primary standard tested for a pressure range of 0 to 1200 bar.
Model: LW70AE
Laser Welding machine has capability of Spot and Seam welding MEMS packages made of metals and alloys such as SS304/304L/316/321, Kovar, Invar etc.
Tool Specifications:
Laser secifications:
Design Rules:
Model: HB16
TPT Wirebonder is semiautomatic machine to establish connectivity between die and substrate.
Specification:
Design Rules:
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Model: DAD321
The Disco Wafer Dicer is a automatic machine, suitable to dice wafer.
Specification:
Design Rules: