Packaging & Systems Facility ( PASF) Packaging and Systems Facility with an area of 2500 SFT is an ESD safe workspace which houses various electronic test & measurement equipments. The PASF offers Hardware and Embedded Design Services to its Users and in addition ESD work stations, soldering and desoldering stations, pressure sensor calibration setup, particulate matter counter, various gas & pressure sensors, electronic modules & components and processors’ based evaluation kits.
The MEMS and IC Packaging facility has the complete capability to convert a wafer into a packaged device – from wafer sawing to wire bonding to precision welding. In addition, there are dedicated setups for pneumatic/hydraulic pressure calibration for pressure sensors and acoustic calibration for acoustic sensors.
